India E-Waste (Management) Rules, 2022 (EPR for electronics, 100+ categories)
- Jurisdiction:
- India
- Type:
- EPR
- Last action:
- Nov 2, 2022
Confirm your obligations under this measure and track its implementing rules
Applies toProducers, manufacturers, brand owners, and importers of electrical and electronic equipment (EEE) placed on the Indian market, including importers of used electrical and electronic equipment
- ·Register on the Extended Producer Responsibility (EPR) Portal maintained by the Central Pollution Control Board (CPCB)
- ·Meet annual e-waste recycling targets as specified in Schedule III (for established producers) or Schedule IV (for new producers with sales operations less than average product life)
- ·Ensure collection, channelization, and recycling of e-waste through registered recyclers or refurbishers
No designated program action is recorded for this measure yet — treat the above as the general obligation and verify against the source text.
- ·Electrical and electronic equipment (EEE) across 100+ categories including IT and telecommunications equipment, consumer electronics, lighting equipment, large and small household appliances, electrical and electronic tools, medical devices, monitoring and control instruments, automatic dispensers, solar photovoltaic modules/panels/cells (excluded from recycling targets), and fluorescent lamps/discharge lamps
- ·Register on the Extended Producer Responsibility (EPR) Portal maintained by the Central Pollution Control Board (CPCB)
- ·Meet annual e-waste recycling targets as specified in Schedule III (for established producers) or Schedule IV (for new producers with sales operations less than average product life)
- ·Ensure collection, channelization, and recycling of e-waste through registered recyclers or refurbishers
- ·Importers of used EEE must fulfill 100% EPR obligation for imported material after end of life, if not re-exported
- ·Comply with Restriction of Hazardous Substances (RoHS) requirements — restrict use of hazardous substances (mercury, lead, cadmium, hexavalent chromium, etc.) in EEE manufacture, subject to exemptions in Schedule II
- ·Obtain RoHS compliance certification through a recognized laboratory
- ·Display RE/CE label on products as required
- ·Submit annual returns/reports as prescribed by CPCB
- ·Coordinate with State Pollution Control Boards and CPCB for EPR compliance monitoring
- ·Ensure e-waste is channelized to registered recyclers or refurbishers
- ·Comply with guidelines and Standard Operating Procedures issued by CPCB for collection, storage, transportation, segregation, refurbishment, dismantling, recycling, and disposal of e-waste
- ·E-waste recycling targets are not applicable for waste generated from solar photovoltaic modules, panels, or cells (Schedule III Note 3, Schedule IV Note 2)
- ·Importers of used EEE are exempt from EPR obligation only if the imported material is re-exported after end of life
- ·Hazardous substance restrictions (RoHS) include numerous material-specific exemptions listed in Schedule II, including: mercury in various fluorescent lamp types (with specified per-lamp limits), lead in glass of cathode ray tubes, lead in glass of fluorescent tubes (≤0.2% by weight), lead as alloying element in steel (≤0.35%), aluminium (≤0.4%), and copper alloys (≤4%), lead in high melting temperature solders (≥85% lead by weight), lead in solders for servers/storage/telecom network infrastructure, lead/cadmium in specific electronic components and glass/ceramic matrices, cadmium in one-shot pellet type thermal cut-offs and electrical contacts, hexavalent chromium as anticorrosion agent in absorption refrigerators (≤0.75% by weight in cooling solution), lead in bearing shells and bushes for HVACR compressors, lead in C-press and non-C-press compliant pin connector systems, lead as coating for thermal conduction module C-ring, lead in white glasses for optical applications, cadmium and lead in filter glasses and reflectance standard glasses, lead in solders for microprocessors (>80% and <85% lead by weight), lead in flip chip semiconductor packages, lead in linear incandescent lamps with silicate coated tubes, lead halide in HID lamps for professional reprography, lead as activator in fluorescent powder (≤1% by weight) for specialty discharge lamps, lead in amalgam compositions for compact energy saving lamps, lead oxide in glass for flat fluorescent lamps for LCDs, lead and cadmium in printing inks for enamels on borosilicate and soda lime glasses, lead in finishes of fine pitch components (pitch ≤0.65 mm), lead in solders for machine through hole ceramic multilayer capacitors, lead oxide in SED displays, lead oxide in glass envelope of black light blue lamps, lead alloys as solder for high-powered loudspeaker transducers (≥125 dB SPL), lead bound in crystal glass, cadmium alloys as solder joints in high-powered loudspeaker transducers (≥100 dB(A)), lead in soldering materials in mercury-free flat fluorescent lamps, lead oxide in seal frit for Argon/Krypton laser tube window assemblies, lead in solders for thin copper wires (≤100 µm diameter) in power transformers, lead in cermet-based trimmer potentiometer elements, mercury as cathode sputtering inhibitor in DC plasma displays (≤30 mg per display), lead in plating layer of high voltage diodes on zinc borate glass, cadmium and cadmium oxide in thick film pastes on aluminium bonded beryllium oxide, cadmium in color converting II-VI LEDs (<10 µg Cd per mm² of light-emitting area) for solid state illumination or display systems
“SCHEDULE - III Sl. No. Year (Y) E-Waste Recycling Target (by weight) 1. 2023 -2024 60% of the quantity of an EEE placed in the market in year Y-X, where 'X' is the average life of that product 2. 2024 -2025 60% of the quantity of an EEE placed in the market in year Y-X, where 'X' is the average life of that product 3. 2025 -2026 70% of the quantity of an EEE placed in the market in year Y-X, where 'X' is the average life of that product 4. 2026-2027 70% of the quantity of an EEE placed in the market in year Y-X, where 'X' is the average life of that product 5. 2027-2028 80% of the quantity of an EEE placed in the market in year Y-X, where 'X' is the average life of that product 6. 2028-2029 onwards 80% of the quantity of an EEE placed in the market in year Y-X, where 'X' is the average life of that product Note: (2) The importers of us ed electrical and electronic equipment shall have 100% extended producer responsibility obligation for the imported material after end of life, if not re-exported.”
“(6) Actions against violation of these rules.”
“(11) Enforcement of provisions regarding reduction in use of hazardous substances in manufacture of electrical and electronic equipment. (13) Set and revise targets for compliance to the reduction in use of hazardous substance in manufacture of electrical and electronic equipment from time to time. (14) Ensure RoHS compliance and its certifications through a recognized lab and its mandatory checks.”
“(1) Operation and maintenance of Extended Producer Responsibility Portal and monitoring of Extended Producer Responsibility compliance.”
“(8) Conducting awareness programmes on e -waste management, RE/CE label, legislation to make consumers responsible towards product usage and safe disposal.”
Tracking dates like these across a whole portfolio of jurisdictions is what Upcoming Deadlines does.
Full bill text
xxxGIDHxxx xxxGIDExxx EXTRAORDINARY PART II—Section 3—Sub-section (i) PUBLISHED BY AUTHORITY No. 713] NEW DELHI, WEDNESDAY, NOVEMBER 2, 2022/KARTIKA 11, 1944 2 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 4 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 6 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] * QEPR = Qp × Cf 8 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] ऄध्याय VIII 10 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 12 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 14 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 16 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 18 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] ≤ 28 mm(e.g. T8): 3.5 mg (4) Tri-band phosphor with normal life time and a tube diameter >28 mm (e.g. T 12):3.5 mg (5) Tri-band phosphor with long life time (≥25000 h):5mg 2.(b) Mercury in other fluorescent lamps not exceeding(per lamp): (1) Linear halophosphate lamps with tube >28 mm (e.g. T 10 and T12):10 mg (2) Non-linear halophosphate lamps(all diameters):15mg (3) Non-linear tri-band phosphor lamps with tube diameter >17 mm(e.g.T9): 15 mg (4) Lamps for other general lighting and special purposes (e.g. induction lamps):15mg 3. Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL)for special purposes not exceeding (per lamp): (a) Short length( 500 mm and 1500 mm): 13mg 4.(a) Mercury in other low pressure discharge lamps (per lamp): 15mg (b) Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner)in lamps with improved colour rendering index Ra>60: (b)-I P ≤155 W : 30 mg (b)-II 155 W 405 W: 40 mg (c) Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): (c)-I P 405 W:40 mg (d) Mercury in High Pressure Mercury (vapour) lamps (HPMV) (e) Mercury in metal halide lamps (MH) (f) Mercury in other discharge lamps for special purposes not specifically mentioned in this Schedule 5.(a) Lead in glass of cathode ray tubes (b) Lead in glass of fluorescent tubes not exceeding 0.2% by weight 6.(a) Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight (b) Lead as an alloying element in aluminium containing up to 0.4% lead by weight (c) Copper alloy containing up to 4% lead by weight 7.(a) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) (b) Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications (c) Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. (d) Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher (e) Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V 8.(a) Cadmium and its compounds in one shot pellet type thermal cut-offs (b) Cadmium and its compounds in electrical contracts 9. Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution (a) Lead in bear ing shells and bushes for refrigerant -containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) application. 10.(a) Lead used in C-press compliant pin connector systems (b) Lead used in other than C-press compliant pin connector systems 11. Lead as a coating material for the thermal conduction module C- ring 12.(a) Lead in white glasses used for optical applications (b) Cadmium and lead in filter glasses and glasses used for reflectance standards. 13. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight 14. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages. 15. Lead in linear incandescent lamps with silicate coated tubes 16. Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications. 17.(a) Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as specialty lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr, Ba)2Mg Si2O7:Pb) (b) Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (Ba Si2O5:Pb) 18. Lead with PbBiSn -Hg and PblnSn -Hg in specific composit ions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL) 19. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs) 20. Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses 21. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less 22. Lead in solders for the soldering to machine through hole discoidal and planar array ceramic multilayer capacitors 23. Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring. 24. Lead oxide in the glass envelope of black light blue lamps 25. Lead alloys as solder for transducers used in high -powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers 26. Lead bound in crystal glass 27. Cadmium alloys as electrical/ mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB(A) and more 36 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] 28. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting) 29. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes 30. Lead in solders for the soldering of thin copper wires of 100 µm diameter and less in power transformers 31. Lead in cermet-based trimmer potentiometer elements 32. Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display 33. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body 34. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide 35. Cadmium in color converting II -VI LEDs (<10 µg Cd per mm of light- emitting area) for use in solid state illumination or display systems. SCHEDULE - III Sl. No. Year (Y) E-Waste Recycling Target (by weight) 1. 2023 -2024 60% of the quantity of an EEE placed in the market in year Y-X, where ‘X’ is the average life of that product 2. 2024 -2025 60% of the quantity of an EEE placed in the market in year Y-X, where ‘X’ is the average life of that product 3. 2025 -2026 70% of the quantity of an EEE placed in the market in year Y-X, where ‘X’ is the average life of that product 4. 2026-2027 70% of the quantity of an EEE placed in the market in year Y-X, where ‘X’ is the average life of that product 5. 2027-2028 80% of the quantity of an EEE placed in the market in year Y-X, where ‘X’ is the average life of that product 6. 2028-2029 onwards 80% of the quantity of an EEE placed in the market in year Y-X, where ‘X’ is the average life of that product Note: (1) E-waste recycling target shall be reviewed and may be increased after the end of year 2028 - (2) The importers of us ed electrical and electronic equipment shall have 100% extended producer responsibility obligation for the imported material after end of life, if not re-exported. (3) E-Waste recycling targets shall not be applicable for waste generated from solar photo - voltaic modules or panels or cells. SCHEDULE - IV Extended Producer Responsibility targets for producers, who have started sales operations recently, i.e. number of years of sales operations is less than ave rage life of their products mentioned in the guidelines issued by the Central Pollution Control Board from time to time. Sl. No. Year E-Waste Recycling Target (by weight ) 1. 2023-2024 15% of the sales figure of financial year 2021-22 2. 2024-2025 20% of the sales figure of financial year 2022-23 3. 2025-2026 onwards 20% of the sales figure of the financial year two years back Note: (1) Once the number of years of sales operation equals the average life of their product mentioned in the guidelines issued by Central Pollution Control Board, their extended producer responsibility obligation shall be as per Schedule-III. (2) E-Waste recycling targets shall not be applicable for waste generated from solar photo -voltaic modules or panels or cells. SCHEDULE - V [See rule (17)] LIST OF AUTHORITIES AND COPRRERSPONDING DUTIES AUTHORITY COPRRERSPONDING DUTIES 1. Central Pollution Control Board (1) Operation and maintenance of Extended Producer Responsibility Portal and monitoring of Extended Producer Responsibility compliance. (2) Coordination with State Pollution Control Boards (3) Prepare and issue guidelines and Standard Operating procedures for collection, storage, transportation, segregation, refurbishment, dismantling, recycling and disposal of e -waste under these rules from time to time, and also issue necessary Forms/ Returns for implementation of these rules. (4) Conduct random check for ascertaining compliance of the e-waste rules and may take help of Customs/State Government or any other agency (ies). (5) Documentation, compilation of data on e-waste and uploading on websites of Central Pollution Control Board. (6) Actions against violation of these rules. (7) Conducting training programmes to develop capacity including State Pollution Control Boards and Urban Local Bodies officials. (8) Conducting awareness programmes on e -waste management, RE/CE label, legislation to make consumers responsible towards product usage and safe disposal. (9) Integrate all stakeholders with the centralized digital system. (10) Submit Annual Report to the Ministry. (11) Enforcement of provisions regarding reduction in use of hazardous substances in manufacture of electrical and electronic equipment. (12) Interaction with IT industry for reducing hazardous substances. (13) Set and revise targets for compliance to the reduction in use of hazardous substance in manufacture of electrical and electronic equipment from time to time. (14) Ensure RoHS compliance and its certifications through a recognized lab and its mandatory checks. (15) Any other function delegated by the Ministry under these rules from time to time. 2. State Pollution Control Boards or Pollution Control Committees of Union territories (1) Inventorisation of e-waste. (2) Monitoring and compliance of Extended Producer Responsibility as directed by Central Pollution Control Board. (3) Conduct random inspection of recycler and refurbisher and monitoring recycling capacity utilization. 38 THE GAZETTE OF INDIA : EXTRAORDINARY [PART II—SEC. 3(i)] (4) Implementation of programmes to encourage environmentally sound recycling. (5) Any other function delegated by the Ministry/ Central Pollution Co ntrol Board under these rules. 3. Responsibilities of Local Bodies (Urban and Rural). (1) To ensure that e -waste if found to be mixed with Municipal Solid Waste is properly segregated, collected and is channelised to registered recycler or refurbisher. (2) To ensure that e -waste pertaining to orphan products is collected and channelized to registered recycler or refurbisher. (3) To facilitate setting up e-waste collection, segregation and disposal systems. (4) Conducting training sessions to develop capacities of the urba n and rural local bodies. 4. Responsibilities of Port authority under Indian Ports Act, 1908 (15 of 1908) and Customs Authority under the Customs Act, (1) Verify the import or export with respect to Extended Producer Responsibility under these rules. (2) Inform Central Pollution Control Board of any illegal traffic for necessary action. (3) Take action against importer for violations under the Indian Ports Act, 1908 or the Customs Act, 1962. 5. Responsibilities of Bureau of Indian Standards/ Ministry of Electronics and Information Technology To issue standards for refurbished products. Bureau of Indian Standards/ Ministry of Electronics and Information Technology shall also develop guidelines for refurbishers with respect to Compulsory Registration Scheme. NARESH PAL GANGWAR, Addl. Secy. Uploaded by Dte. of Printing at Government of India Press, Ring Road, Mayapuri, New Delhi-110064 and Published by the Controller of Publications, Delhi-110054.
Full text as ingested. Verify against the official source above.